Sing Fung Interlligent Manufacturing(CRF plasma)(en.sfi-crf.com) main plasma cleaning machine, vacuum plasma cleaning machine, plasma surface treatment equipment and other technical equipment.The machine can support custom design.  rnContact information:rnemail:shaobo@rnrnsfi-crf.com,rnskype:+86 13632675935,rnWeChat:13632675935rnrnplasma cleaner wire bonding:rnrnNamernrnVacuum plasma processing systemrnrnModelrnrnCRF-VPO-4L-SrnrnControl systemrnrnPLC+touch screenrnrnPower supplyrnrn380V/AC,50/60Hz, 3kwrnrnRF Powerrnrn1000W/40KHz/13.56MHzrnrnCapacity (Volume)rnrn30L(Option)rnrnNumber of layers (Electrode of plies)rnrn4(Option)rnrnEffective processing area (Area)rnrn200(L)*150(W)(Option)rnrnGas channel (Gas)rnrnTwo working gas options: Ar, N2, CF4, O2rnrnFeaturesrnLarge processing space, increase processing capacity, adopt PLC+touch screen control system, accurately control equipment operation;rnThe capacity and number of layers of the equipment cavity can be customized according to customer requirements to meet customer needs; maintenance and repair costs are low, which is convenient for customer cost control;rnHigh precision, fast response, good controllability and compatibility, perfect functions and professional technical support.rn rnScope of applicationrnVacuum plasma cleaning machine is suitable for printed circuit board industry, semiconductor IC field, silica gel, plastic, polymer field, automotive electronics industry, aviation industry, etc. Printed circuit board industry: high-frequency board surface activation, multilayer board surface cleaning, de-drilling dirt, soft board, soft-hard combined board surface cleaning, de-drilling dirt, activation before soft board reinforcement. Semiconductor IC field: COB, COG, COF, ACF process, used for cleaning before bonding and welding; silica gel, plastic, polymer field silica gel, plastic, polymer plasma surface roughening, etching, and activation.rnrn